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 AP9973M
Advanced Power Electronics Corp.
Low Gate Charge Single Drive Requirement Surface Mount Package
D1 G2 S2 D1 D2 D2
N-CHANNEL ENHANCEMENT MODE POWER MOSFET
BVDSS RDS(ON) ID
60V 80m 3.9A
SO-8
S1
G1
Description
The Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching, ruggedized device design, lower on-resistance and cost-effectiveness.
D1 D2
G1 S1
G2 S2
Absolute Maximum Ratings
Symbol VDS VGS ID@TA=25 ID@TA=100 IDM PD@TA=25 TSTG TJ Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current , VGS @ 10V Continuous Drain Current , VGS @ 10V Pulsed Drain Current
1,2 3 3
Rating 60 20 3.9 2.5 20 2 0.016 -55 to 150 -55 to 150
Units V V A A A W W/
Total Power Dissipation Linear Derating Factor Storage Temperature Range Operating Junction Temperature Range
Thermal Data
Symbol Rthj-a Parameter Thermal Resistance Junction-ambient
3
Value Max. 62.5
Unit /W
Data and specifications subject to change without notice
201029031
AP9973M
Electrical Characteristics@Tj=25oC(unless otherwise specified)
Symbol BVDSS
BVDSS/Tj
Parameter Drain-Source Breakdown Voltage
2
Test Conditions VGS=0V, ID=250uA
Min. 60 1 -
Typ. 0.06 3.5 8 2 4 8 4 20 6 700 80 50
Max. Units 80 100 3 1 25 100 13 1120 V V/ m m V S uA uA nA nC nC nC ns ns ns ns pF pF pF
Breakdown Voltage Temperature Coefficient Reference to 25, ID=1mA
RDS(ON)
Static Drain-Source On-Resistance
VGS=10V, ID=3.9A VGS=4.5V, ID=2A
VGS(th) gfs IDSS IGSS Qg Qgs Qgd td(on) tr td(off) tf Ciss Coss Crss
Gate Threshold Voltage Forward Transconductance
Drain-Source Leakage Current (Tj=25 C) Drain-Source Leakage Current (Tj=70 C)
o o
VDS=VGS, ID=250uA VDS=10V, ID=3.9A VDS=60V, VGS=0V VDS=48V ,VGS=0V VGS= 20V ID=3.9A VDS=48V VGS=4.5V VDS=30V ID=1A RG=3.3,VGS=10V RD=30 VGS=0V VDS=25V f=1.0MHz
Gate-Source Leakage Total Gate Charge
2
Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance
2
Source-Drain Diode
Symbol VSD Parameter Forward On Voltage
2
Test Conditions IS=3.9A, VGS=0V IS=3.9A, VGS=0V, dI/dt=100A/s
Min. -
Typ. 28 35
Max. Units 1.2 V ns nC
trr
Qrr
Reverse Recovery Time Reverse Recovery Charge
Notes:
1.Pulse width limited by Max. junction temperature. 2.Pulse width <300us , duty cycle <2%. 3.Surface mounted on 1 in2 copper pad of FR4 board ; 135/W when mounted on min. copper pad.
AP9973M
40 30
35
T A =25 o C
ID , Drain Current (A)
30
ID , Drain Current (A)
10V 6.0V 5.0V 4.5V
25
T A =150 o C
10V 6.0V 5.0V 4.5V
20
25
20
15
15
10
10
5
V G =3.0V
5
V G =3.0V
0 0 1 2 3 4 5 6 7 8
0 0 1 2 3 4 5 6 7 8
V DS , Drain-to-Source Voltage (V)
V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
95
2.5
I D =3.9A
90
I D =3.9A
2.0
T A =25 C Normalized RDS(ON)
o
V G =10V
85
RDS(ON) (m )
1.5
80
1.0
75
0.5
70
3 5 7 9 11
0.0 -50 0 50 100 150
V GS , Gate-to-Source Voltage (V)
T j , Junction Temperature ( o C)
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance v.s. Junction Temperature
2.5
4
3
2
2
VGS(th) (V)
1.4
IS(A)
o T j =150 C
T j =25 o C
1.5
1
1
0
0.5 0 0.2 0.4 0.6 0.8 1 1.2 -50 0 50 100 150
V SD , Source-to-Drain Voltage (V)
T j ,Junction Temperature ( o C)
Fig 5. Forward Characteristic of
Reverse Diode
Fig 6. Gate Threshold Voltage v.s. Junction Temperature
AP9973M
14 10000
f=1.0MHz
I D =3.9A
12
VGS , Gate to Source Voltage (V)
10
V DS =48V V DS =38V V DS =30V C (pF)
1000
8
Ciss
6
100 4
Coss Crss
2
0 0 5 10 15 20 25 30 35 40
10 1 5 9 13 17 21 25 29
Q G , Total Gate Charge (nC)
V DS , Drain-to-Source Voltage (V)
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
100
1
Normalized Thermal Response (R thja)
Duty factor=0.5
10
0.2
0.1
0.1
0.05
ID (A)
1
1ms 10ms
0.02
PDM t T
Duty factor = t/T Peak Tj = PDM x Rthja + Ta Rthja=135/W
0.01
0.01
Single Pulse
0.1
T A =25 C Single Pulse
0.01 0.1 1 10 100
o
100ms 1s DC
0.001
1000
0.0001
0.001
0.01
0.1
1
10
100
1000
V DS , Drain-to-Source Voltage (V)
t , Pulse Width (s)
Fig 9. Maximum Safe Operating Area
Fig 10. Effective Transient Thermal Impedance
VDS 90%
VG QG 4.5V QGS QGD
10% VGS td(on) tr td(off) tf Charge Q
Fig 11. Switching Time Waveform
Fig 12. Gate Charge Waveform


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